Arthya Puguh

Title: Arthya Puguh: Innovator in Blister Packaging Technology

Introduction

Arthya Puguh is a notable inventor based in Neenah, Wisconsin. He has made significant contributions to the field of packaging technology, particularly in the development of blister packaging components. His innovative approach has led to advancements that enhance the functionality and efficiency of packaging solutions.

Latest Patents

Arthya Puguh holds a patent for blister packaging components. The invention relates to blister components formed from multilayer thermoplastic films. In one preferred embodiment, the blister component features a layer sequence configuration of A/B/C/B/A. Layer A is a first exterior layer made of cyclic olefin copolymer (COC), while layer B serves as an interior layer comprising high-density polyethylene (HDPE) or its blends. Layer C acts as a central core layer. Alternatively, the configuration can be A/B/C/B/D, where layer D is a second exterior layer. This innovative design improves the overall performance of blister packages.

Career Highlights

Throughout his career, Arthya Puguh has worked with prominent companies in the packaging industry. Notable among these are Bemis Company, Inc. and Amcor Flexibles North America, Inc. His experience in these organizations has contributed to his expertise in packaging technologies.

Collaborations

Arthya has collaborated with several professionals in his field, including Michael D. Priscal and Christopher L. Osborn. These collaborations have fostered innovation and development in packaging solutions.

Conclusion

Arthya Puguh is a distinguished inventor whose work in blister packaging technology has made a significant impact on the industry. His innovative designs and collaborations continue to influence the future of packaging solutions.