Bemis Company, Inc.

Amcor Flexibles North America, Inc.

Arthya Puguh

Michael D Priscal

Christopher L Osborn

The present invention relates to blister components for blister packages formed from multilayer thermoplastic films. In one preferred embodiment of the present invention, the blister component has a layer sequence configuration of A/B/C/B/A. Preferably, layer A is a first exterior layer comprising cyclic olefin copolymer (COC), layer B is an interior layer comprising a high density polyethylene (HDPE), a blend of high density polyethylene, a high density polyethylene nucleation additive and optionally, a hydrocarbon resin (HDPE-Blend), or a bimodal high density polyethylene having a distribution of a low molecular weight region and a high molecular weight region (HDPE-Bimodal), or a high density polyethylene having a thickness of between 38.1 pm to 190.5 pm (1.5 mil to 7.5 mil), layer C is a central core layer. Alternatively, the blister component has a layer sequence configuration of A/B/C/B/D, where layer D is a second exterior layer.

Growing community of inventors

Neenah, WI, United States of America

Arthya Puguh