The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 2017
Filed:
Jun. 06, 2014
Bemis Company, Inc., Neenah, WI (US);
Michael D. Priscal, Neenah, WI (US);
Arthya Puguh, Neenah, WI (US);
Bemis Company, Inc., Neenah, WI (US);
Abstract
The present invention relates to blister components for blister packages formed from multilayer thermoplastic films. In one preferred embodiment of the present invention, the blister component has a layer sequence configuration of A/B/C/B/A. Preferably, layer A is a first exterior layer comprising cyclic olefin copolymer (COC), layer B is an interior layer comprising a high density polyethylene (HDPE), a blend of high density polyethylene, a high density polyethylene nucleation additive and optionally, a hydrocarbon resin (HDPE-Blend), or a bimodal high density polyethylene having a distribution of a low molecular weight region and a high molecular weight region (HDPE-Bimodal), or a high density polyethylene having a thickness of between 38.1 pm to 190.5 pm (1.5 mil to 7.5 mil), layer C is a central core layer. Alternatively, the blister component has a layer sequence configuration of A/B/C/B/D, where layer D is a second exterior layer.