Moerdijk, Netherlands

Arnoldus J C B De Vet

This inventor holds 1 USPTO granted patent. Top assignee: Adeia Semiconductor Bonding Technologies Inc.. Active years: 2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Arnoldus J C B De Vet. Retrieved from https://idiyas.com/inventor/arnoldus-j-c-b-de-vet

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2013

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1 patent (USPTO):Explore Patents

Title: Arnoldus J. C. B. De Vet: Semiconductor Bonding Inventor

Introduction

Arnoldus J. C. B. De Vet is an inventor based in Moerdijk, Netherlands. His patent work addresses wirebonding methods and equipment for semiconductor manufacturing. He is associated with Adeia Semiconductor Bonding Technologies Inc.

Latest Patents

De Vet is credited with 1 patent, titled “Wirebonding Method and Apparatus.” The invention describes a method for wirebonding leads from multiple lead frames to semiconductor products mounted on those frames. A stationary clamp and a movable clamp hold the products during the process. As the lead-frame assembly indexes, the movable clamp follows its movement, allowing wirebonding to continue without interruption for indexing.

Career Highlights

The patent reflects De Vet’s work on improving the continuity of semiconductor wirebonding operations. By coordinating the movable clamp with the indexing lead-frame assembly, the method is designed to keep the bonding process running during repositioning.

Collaborations

De Vet’s listed coworkers include Joep Stokkermans and Thomas Markus Kampschreur. His patent is associated with Adeia Semiconductor Bonding Technologies Inc.

Conclusion

Arnoldus J. C. B. De Vet’s patent focuses on maintaining uninterrupted wirebonding during lead-frame indexing, contributing a practical process innovation for semiconductor manufacturing.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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