The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8474680 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 02, 2013

Filed:

Jul. 20, 2009
Applicants:

Thomas M. Kampschreur, Arnhem, NL;

Joep Stokkermans, Nijmegen, NL;

Arjan F. Bakker, Helenaveen, NL;

Piet C. J. Van Rens, Asten, NL;

Arnoldus J. C. B. DE Vet, Moerdijk, NL;

Piet Van Der Meer, Breda, NL;

Inventors:

Thomas M. Kampschreur, Arnhem, NL;

Joep Stokkermans, Nijmegen, NL;

Arjan F. Bakker, Helenaveen, NL;

Piet C. J. Van Rens, Asten, NL;

Arnoldus J. C. B. De Vet, Moerdijk, NL;

Piet Van Der Meer, Breda, NL;

Assignee:

Invensas Corporation, San Jose, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 31/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.


Find Patent Forward Citations

Kampschreur, Thomas. (2013). Wirebonding method and apparatus (U.S. Patent No. 8474680). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8474680

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