The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 02, 2013
Filed:
Jul. 20, 2009
Thomas M. Kampschreur, Arnhem, NL;
Joep Stokkermans, Nijmegen, NL;
Arjan F. Bakker, Helenaveen, NL;
Piet C. J. Van Rens, Asten, NL;
Arnoldus J. C. B. DE Vet, Moerdijk, NL;
Piet Van Der Meer, Breda, NL;
Thomas M. Kampschreur, Arnhem, NL;
Joep Stokkermans, Nijmegen, NL;
Arjan F. Bakker, Helenaveen, NL;
Piet C. J. Van Rens, Asten, NL;
Arnoldus J. C. B. De Vet, Moerdijk, NL;
Piet Van Der Meer, Breda, NL;
Invensas Corporation, San Jose, CA (US);
Abstract
A method and apparatus are discloses for wirebonding leads of a plurality of lead frames being part of a lead frame assembly by a wirebonding tool to semiconductor products mounted on the respective lead frames. The semiconductor products are clamped by a clamping mechanism comprising a stationary clamp and a movable clamp. The movable clamp follows the indexing movement of the lead frame assembly during wirebonding of the semiconductor products clamped by the movable clamp. The wirebonding process does not need to be interrupted for the indexing.