Braunschweig, Germany

Arne Jacob

This inventor holds 4 USPTO granted patents. Top assignees: Technische Universitat Braunschweig, Volkswagen Ag. Active years: 2004-2010.


Average Co-Inventor Count = 2.5

ph-index = 3

Forward Citations = 45(Granted Patents)


Company Filing History:


Years Active: 2004-2010

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4 patents (USPTO):Explore Patents

Title: Arne Jacob: Innovator in Multi-layer Capacitors and Integrated Circuit Modules

Introduction

Arne Jacob is a notable inventor based in Braunschweig, Germany. He has made significant contributions to the field of electronics, particularly in the development of multi-layer capacitors and integrated circuit modules. With a total of 4 patents to his name, Jacob's work has had a lasting impact on the industry.

Latest Patents

One of Jacob's latest patents is for a multi-layer capacitor. This innovative design includes several electrically insulating layers that are stacked on top of one another. Parallel electrode plates are arranged between the insulating layers, alternately one on top of the other, with each plate separated by an intervening insulating layer. The design features at least one first connecting line that extends perpendicularly through the layers, connecting to one set of electrode plates while being insulated from the other set. Additionally, second connecting lines also extend perpendicularly through the layers, connecting to the other set of plates. The first connecting line is centrally positioned through the stacked electrode plates and is designed to carry high-frequency signals.

Another significant patent by Jacob is for a multichip circuit module and the method for its production. This module includes a main board and at least one carrier substrate that is mounted on and in electrical contact with the main board. A semiconductor chip is arranged on the carrier substrate and is in electrical contact with it. The carrier substrate features at least one cavity on its assembly surface for receiving the semiconductor chip, which includes connecting contacts that join with associated bumps on the semiconductor chip using a flip-chip technique. The assembly surface of the carrier substrate is placed on a contact surface of the main board, with a filling material provided between the two surfaces.

Career Highlights

Throughout his career, Arne Jacob has worked with prestigious organizations such as Technische Universität Braunschweig and Volkswagen AG. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking innovations in electronics.

Collaborations

Jacob has collaborated with notable colleagues, including Johann Heyen and Ernst Lissel. These partnerships have fostered an environment of creativity and innovation, leading to advancements in their respective fields.

Conclusion

Arne Jacob's contributions to the field of electronics through his patents and collaborations highlight his role as a significant inventor. His work continues to influence the development of

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