Technische Universitat Braunschweig

Volkswagen Ag

Arne Jacob

Johann Heyen

Ernst Lissel

Gerald Oberschmidt

Carsten Metz

Andreas Schlachetzki

Hergo-H Wehmann

Holger Schroeter

Bert Jannsen

Erwin Peiner

A multi-layer capacitor includes several electrically insulating layers that are stacked on top of one another. Parallel electrode plates are arranged between the insulating layers alternately one on top of the other, with each of the plates being separated by an intervening insulating layer. At least one first connecting line which extends perpendicularly through the layers is connected to one set of electrode plates and is insulated in relation to the other set of second electrode plates. Similarly, second connecting lines extend perpendicularly through the layers and are connected to the other set of plates and are insulated in relation to the one set of plates. The first connecting line extends centrally through the stacked electrode plates and is designed to carry a high-frequency signal.

Multi-layer capacitor and integrated circuit module

A multichip circuit module includes a main board, at least one carrier substrate mounted on and in electrical contact with the main board, and at least one semiconductor chip arranged on the carrier substrate and in electrical contact therewith. The carrier substrate has at least one cavity on an assembly surface for receiving the semiconductor chip. The cavity includes connecting contacts which join with associated bumps on the semiconductor chip using a flip-chip technique. The assembly surface of the carrier substrate is placed on a contact surface of the main board, and a filling material is provided between the contract surface of the main board and the assembly surface of the carrier substrate.

Multichip circuit module and method for the production thereof

An apparatus for determining the properties of a material, that is to be examined, by applying a swept-frequency high frequency signal and measuring a reflection factor of the resonance signal. The apparatus has a microwave supply conductor for feeding the high frequency signal, a sensor waveguide that is coupled to the microwave supply conductor, a helical conductor that is arranged inside the sensor waveguide, and an intermediate layer between a first end of the sensor waveguide and the helical conductor. Typically, the sensor waveguide is cylindrical and the helical conductor is supported centrally therein along the longitudinal axis of the sensor waveguide by a support that is part of the intermediate layer. A coupling layer is provided between the helical conductor and the material to be examined in the region of a second end face of the sensor waveguide.

Resonant microwave sensor

A radar sensor and a radar antenna are for monitoring the environment of a motor vehicle. A compact construction is achieved by the planar array of both the control circuit and the radar antenna, so that the radar sensor may be located, for example, in the area of a motor-vehicle bumper. Example configurations consist of the separate line support for arranging lines to transmit high-frequency signals between the control circuit and the radar antenna and the configuration of the radar antenna as a Rotman lens, in relation to the signal propagation times and the layered arrangement of Rotman lens and group antenna.

Radar sensor and radar antenna for monitoring the environment of a motor vehicle

Growing community of inventors

Braunschweig, Germany

Arne Jacob