IDiyas

For the Inventor, By the Inventor

Munich, Germany

Armin Fischer

USPTO Granted Patents = 14

 

Average Co-Inventor Count = 2.2

ph-index = 3

Forward Citations = 34(Granted Patents)


Location History:

  • München, DE (2005 - 2011)
  • Munich, DE (2010 - 2013)

Company Filing History:

goldMedal12 out of 14,705 
 
Infineon Technologies Ag
 patents
silverMedal2 out of 164,108 
 
International Business Machines Corporation
 patents
bronzeMedal2 out of 244 
 
Infineon Technologies North America Corp.
 patents
where one patent can have more than one assignee

Years Active: 2005-2013

where 'Filed Patents' based on already Granted Patents

14 patents (USPTO):
1. 8487453 - Integrated circuit with pads connected by an under-bump metallization and method for production thereof (2013-07-16),
2. 8323991 - Method for detecting stress migration properties (2012-12-04),
3. 8314452 - MIM capacitors in semiconductor components (2012-11-20),
4. 8101495 - MIM capacitors in semiconductor components (2012-01-24),
5. 7998828 - Method of forming metal ion transistor (2011-08-16),
6. 7919363 - Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof (2011-04-05),
7. 7888672 - Device for detecting stress migration properties (2011-02-15),
8. 7859025 - Metal ion transistor (2010-12-28),
9. RE41684 - Set of integrated capacitor arrangements, especially integrated grid capacitors (2010-09-13),
10. 7482288 - Method for producing a grid cap with a locally increased dielectric constant (2009-01-27),
11. 7327152 - Integrated test circuit arrangement and test method (2008-02-05),
12. 7315998 - Integrated circuit arrangement with intermediate materials and associated components (2008-01-01),
13. 7079375 - Set of integrated capacitor arrangements, especially integrated grid capacitors (2006-07-18),
14. 6940720 - Integrated circuit having a thermally shielded electric resistor trace (2005-09-06),
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