Yerevan, Armenia

Armen Kteyan


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2017

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2 patents (USPTO):Explore Patents

Title: Armen Kteyan: Innovator in Leakage Reduction and Thermal Analysis

Introduction

Armen Kteyan is a notable inventor based in Yerevan, Armenia. He has made significant contributions to the field of technology, particularly in the areas of leakage reduction and thermal analysis. With a total of 2 patents, Kteyan's work has garnered attention for its innovative approaches to complex engineering challenges.

Latest Patents

Kteyan's latest patents include "Leakage reduction using stress-enhancing filler cells" and "Chip-scale electrothermal analysis." The first patent focuses on techniques for inserting stress-enhancing filler cells to reduce leakage current in layout designs. By performing stress analysis, Kteyan identifies devices with large leakage currents and optimizes the placement of filler cells to enhance performance. The second patent addresses the determination of temperature distribution across chips generated by on-chip devices. It involves extracting effective thermal conductance and capacity for various regions, constructing a thermal circuit, and performing simulations to ascertain temperature information.

Career Highlights

Armen Kteyan is currently associated with Mentor Graphics Corporation, a leading company in electronic design automation. His work at Mentor Graphics has allowed him to apply his innovative ideas in practical applications, contributing to advancements in the industry.

Collaborations

Kteyan has collaborated with notable colleagues such as Valeriy K Sukharev and Junho Choy. These collaborations have further enriched his research and development efforts, leading to impactful technological advancements.

Conclusion

Armen Kteyan's contributions to technology through his patents and work at Mentor Graphics Corporation highlight his role as an influential inventor. His innovative approaches to leakage reduction and thermal analysis continue to shape the future of electronic design.

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