Company Filing History:
Years Active: 1981-2000
Title: Innovations by Armando S Cammarano
Introduction
Armando S Cammarano is a notable inventor based in Hyde Park, NY (US). He has made significant contributions to the field of electronics, particularly in thermal management and semiconductor technology. With a total of 10 patents to his name, Cammarano's work has had a substantial impact on the industry.
Latest Patents
Cammarano's latest patents include an innovative design for an electronic module adjustment process using shims. This invention focuses on a thermal conduction module that cools integrated circuit chips mounted on a substrate. The design incorporates shims between the base plate and cover plate to maintain a specific dimension for thermal paste insertion. The shims can be made from various materials, including metal and engineered plastics, ensuring durability and effectiveness over time.
Another significant patent is the multi-layer solder seal band for semiconductor substrates. This invention provides a new method for creating a hermetic seal for chip carriers, enhancing both the lifetime and environmental protection of the chips. The preferred embodiment features a three-layer solder sandwich structure, which combines high reliability with cost-effectiveness.
Career Highlights
Cammarano is currently employed at International Business Machines Corporation (IBM), where he continues to innovate and develop new technologies. His work at IBM has allowed him to collaborate with other talented professionals in the field.
Collaborations
Some of Cammarano's notable coworkers include Giulio DiGiacomo and Nunzio DiPaolo. Their collaborative efforts have contributed to the advancement of various projects within the company.
Conclusion
Armando S Cammarano's contributions to the field of electronics through his patents and innovations demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and inspire future innovations.