International Business Machines Corporation

Armando S Cammarano

Giulio DiGiacomo

Nunzio DiPaolo

Raed A Sherif

Stephen S Drofitz, Jr

Michael J Ellsworth, Jr

Hilton T Toy

David L Edwards

Sushumna Iruvanti

Frank Louis Pompeo

Lewis Sigmund Goldmann

William Edward Sablinski

Mark G Courtney

Jeffrey Thomas Coffin

Patrick Anthony Coico

Gaetano Paolo Messina

Ronald L Hering

Eric B Hultmark

A thermal conduction module for cooling one or more integrated circuit chips mounted on a substrate is described. At least one shim is disposed between the base plate and the cover plate of the module to establish a predetermined dimension between the cover plate and the integrated circuit chips mounted on the substrate for insertion of a thermal paste. The shims may be metal, engineered plastic, or thermally and electrically conductive or nonconductive creep resistant materials able to withstand the stress and load within the module over time. The shim may be a plurality of shims having the same thickness or a plurality of shims having a multiplicity of thicknesses. Most preferably, the shim conforms to the periphery of the cover plate or base plate. A method of determining the proper shim thickness is also described wherein an initial reading of the thickness of the cover plate and base plate of the module is obtained. A second reading of the thickness of the module is obtained after the substrate, mounted with at least one integrated circuit chip, is placed onto the base plate followed by a temporary spacer and the cover plate. One or more shims are selected which are equal to the difference between the initial reading and the second reading. The cover plate is removed and the spacer is replaced with the appropriate shim. The cover plate is then fastened to the base plate. Also described is a kit for fixing the thermal paste gap dimension in electronic modules comprising a base plate, cover plate, and a plurality of shims having a multiplicity of thicknesses.

Electronic module adjustment design and process using shims

The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.

Multi-layer solder seal band for semiconductor substrates

Multi-layer solder seal band for semiconductor substrates and process

This invention relates generally to structure and method for corrosion- and stress-resistant interconnecting metallurgy, and more specifically to new structures and methods for corrosion- and stress-resistant interconnecting multilayer metallurgical pad comprising sequentially deposited layers of chromium, nickel and noble or relatively noble metal as the interconnecting metallurgy, or multilayer metallurgical pad comprising sequentially deposited layers of chromium, soluble noble metal, nickel and noble or relatively noble metal as the interconnecting metallurgy. This invention also relates to an improved multilayer metallurgical pad or metallurgical structure for mating at least a portion of a pin or a connector or a wire to a substrate.

Structure and method for corrosion and stress-resistant interconnecting

A ternary-alloy/glass composite suitable for use in vias in glass-ceramic electronic structures includes gold, palladium, and either platinum or silver in the alloy where the gold is less than 50% by weight of the alloy. The alloy is combined with glass frit where the glass is present as 5-50% by volume in the composition. The ternary-alloy glass composite is sintered in the glass-ceramic structure and provides a hermetic seal. Chips and pins can be bonded directly to the ternary-alloy/glass composite using a eutectic braze without causing cracks in the glass-ceramic. The ternary-alloy/glass composite has good adhesion with glass-ceramics and is useful in vias in electronic structures.

Low-cost ternary composite for use in vias in glass-ceramic structures

A method of brazing two surfaces together with a Au/Sn brazing solder. The method includes the additional step of providing a film of Cu, for example on one of the surfaces, in addition to the Au/Sn brazing solder.

Process for brazing

A pin designed to be attached to a solid state module for making connection between the module and other parts of a metallurgical system. The end of the pin that is to be brazed to the module has a sloping (e.g., conical or wedge) shaped head so that gas bubbles can readily escape during brazing, thus reducing voids in the braze.

Pin for brazing to a substrate and improved package resulting therefrom

A method for determining the paths of current flow in an irregularly shaped conductor. A metal is plated onto a substrate in the desired geometric pattern. The metal is then brought to within about 4 percent of its melting point and a current is put through it. After an amount of time that depends upon the temperature and current utilized, there will have been a mass migration in the metal resulting in a corrugated surface having ridges and valleys that are parallel to the current flow. The ridges and valleys may be observed optically or by scanning electron microscope.

Growing community of inventors

Hyde Park, NY, United States of America

Armando S Cammarano