Hillsboro, OR, United States of America

Aranzazu Maestre Caro

USPTO Granted Patents = 3 

Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2019-2020

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3 patents (USPTO):

Title: Aranzazu Maestre Caro: Innovator in Electroless Plating Technologies

Introduction

Aranzazu Maestre Caro is a notable inventor based in Hillsboro, Oregon, who has made significant contributions to the field of electroless plating technologies. With a total of 3 patents to his name, Maestre Caro has developed innovative methods that enhance the functionality of packaging materials and integrated circuits.

Latest Patents

One of Maestre Caro's latest patents involves a method for selective electroless plating on packaging materials. This method includes activating an area of a polymer layer on a substrate using electromagnetic radiation, modifying the activated area, and forming a self-assembled monolayer on the modified area. The process further involves reacting the self-assembled monolayer with a conductive material. Another patent focuses on activating a polymer dielectric layer for creating electrically conductive lines, which also utilizes self-assembled monolayers and electroless plating techniques. Additionally, he has developed methods for forming interconnects with self-assembled monolayers, which promote the electroless deposition of metal for integrated circuit interconnects.

Career Highlights

Aranzazu Maestre Caro is currently employed at Intel Corporation, where he continues to push the boundaries of innovation in his field. His work has been instrumental in advancing technologies that are crucial for modern electronics.

Collaborations

Throughout his career, Maestre Caro has collaborated with talented individuals such as Fay Hua and Ramanan Chebiam, contributing to a dynamic and innovative work environment.

Conclusion

Aranzazu Maestre Caro's contributions to electroless plating technologies exemplify the spirit of innovation in the tech industry. His patents not only enhance the capabilities of packaging materials but also play a vital role in the development of integrated circuits.

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