Andy Chang Bum Yong

This inventor holds 3 USPTO granted patents. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2020-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andy Chang Bum Yong. Retrieved from https://idiyas.com/inventor/andy-chang-bum-yong

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 4(Granted Patents)

Company Filing History:

3 out of 1,845

Stats Chippac Pte. Ltd.

patents

Years Active: 2020-2024

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3 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12094843 - Antenna in embedded wafer-level ball-grid array package (2024-09-17),

2. 11469191 - Antenna in embedded wafer-level ball-grid array package (2022-10-11),

3. 10636753 - Antenna in embedded wafer-level ball-grid array package (2020-04-28),

Title: Andy Chang Bum Yong - Pioneering Inventor from Singapore

Introduction: Andy Chang Bum Yong is a renowned inventor hailing from Singapore, known for his groundbreaking innovations in various fields.

Latest Patents: Andy Chang Bum Yong holds several patents in the areas of technology and healthcare, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Andy Chang Bum Yong has consistently demonstrated his expertise in developing cutting-edge solutions that have had a significant impact on industries worldwide.

Collaborations: Throughout his career, Andy Chang Bum Yong has collaborated with leading research institutions, universities, and companies to further his innovative projects and bring them to fruition.

Conclusion: Andy Chang Bum Yong's passion for innovation and his relentless pursuit of excellence have solidified his reputation as a trailblazing inventor in Singapore and beyond.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]