This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Intel Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Andrey Gunawan and Panel-Level Thermocompression Bonding
Introduction
Andrey Gunawan is an inventor based in Paradise Valley, Arizona, and is associated with Intel Corporation. His patent work addresses thermocompression bonding, a process used in semiconductor packaging to join chips and other components.
Latest Patents
Gunawan is named on one patent, Method for Panel-Level Thermo-Compression Bonding. The disclosure describes a bonding tool with a bond head that applies heat and compression, a sensor, a heated compression stage, and a controller. The controller uses a programmed displacement and temperature profile together with measured offsets to help control chip gap height and alignment.
Career Highlights
Gunawan’s listed invention focuses on improving control during panel-level bonding. By coordinating temperature, displacement, and measurement data, the method is designed to support accurate chip positioning and consistent bonding.
Collaborations
The patent information also names Minglu Liu and Gang Duan as coworkers associated with Gunawan’s work. The disclosed technology reflects collaborative engineering in semiconductor packaging at Intel Corporation.
Conclusion
Andrey Gunawan’s patent contribution centers on controlling chip alignment and gap height during thermocompression bonding, an important process in semiconductor manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile