The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2026
Filed:
Dec. 01, 2022
Applicant:
Intel Corporation, Santa Clara, CA (US);
Inventors:
Minglu Liu, Chandler, AZ (US);
Andrey Gunawan, Paradise Valley, AZ (US);
Gang Duan, Chandler, AZ (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 90/00 (2026.01); H10W 72/0198 (2026.01); H10W 72/0711 (2026.01); H10W 72/07113 (2026.01); H10W 72/07141 (2026.01); H10W 72/07173 (2026.01); H10W 72/07178 (2026.01); H10W 72/072 (2026.01); H10W 72/07231 (2026.01); H10W 72/07232 (2026.01); H10W 72/07236 (2026.01);
Abstract
The present disclosure is directed to a thermocompression bonding tool having a bond head with a surface for compression and heating and a sensor, a stage for compression and heating, and a controller, and a method for its use for chip gap height and alignment control. For chip gap height and alignment control, the controller is provided with a recipe displacement and temperature profile and measured offsets.
Quick Actions:
Liu, Minglu. (2026). Method for panel-level thermo-compression bonding (U.S. Patent No. 12765418). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12765418
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile