Andrew Siordia

Title: The Innovations of Andrew Siordia

Introduction

Andrew Siordia is a notable inventor based in Sunnyvale, CA. He has made significant contributions to the field of chemical mechanical polishing, holding a total of 3 patents. His work focuses on enhancing the efficiency and accuracy of polishing processes through innovative methods.

Latest Patents

One of Andrew's latest patents is titled "Compensation for slurry composition in in-situ electromagnetic inductive monitoring." This invention outlines a method of chemical mechanical polishing that involves bringing a conductive layer of a substrate into contact with a polishing pad. The process includes supplying a polishing liquid to the pad, generating relative motion between the substrate and the pad, and monitoring the substrate with an in-situ electromagnetic induction monitoring system. As the conductive layer is polished, a sequence of signal values is generated that depends on the thickness of the conductive layer. The invention also details how to determine a sequence of thickness values based on these signal values, including compensating for the contribution of the polishing liquid.

Career Highlights

Andrew Siordia is currently employed at Applied Materials, Inc., where he continues to develop innovative solutions in the field of semiconductor manufacturing. His expertise in chemical mechanical polishing has positioned him as a key contributor to advancements in this technology.

Collaborations

Andrew has collaborated with notable colleagues such as Kun Xu and Hari N Soundararajan, further enhancing the innovative environment at Applied Materials, Inc.

Conclusion

Andrew Siordia's contributions to the field of chemical mechanical polishing through his patents and collaborative efforts highlight his role as a significant inventor in the industry. His work continues to influence advancements in semiconductor manufacturing processes.