The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 07, 2023

Filed:

Jun. 21, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Hari Soundararajan, Sunnyvale, CA (US);

Shou-Sung Chang, Mountain View, CA (US);

Haosheng Wu, San Jose, CA (US);

Jianshe Tang, San Jose, CA (US);

Jeonghoon Oh, Saratoga, CA (US);

Rajeev Bajaj, Fremont, CA (US);

Andrew Siordia, Sunnyvale, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2012.01); B24B 37/015 (2012.01); B24B 37/20 (2012.01); B24B 57/02 (2006.01); B24B 37/27 (2012.01); G05D 23/24 (2006.01);
U.S. Cl.
CPC ...
B24B 37/015 (2013.01); B24B 37/20 (2013.01); B24B 37/27 (2013.01); B24B 57/02 (2013.01); G05D 23/2401 (2013.01);
Abstract

A chemical mechanical polishing apparatus includes a platen to hold a polishing pad, a carrier to hold a substrate against a polishing surface of the polishing pad during a polishing process, a dispenser to supply a polishing liquid to the polishing surface, and a temperature control system including a body configured to contact the polishing surface or the polishing liquid on the polishing surface. The body supports a thermal control module positioned over the polishing pad.


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