This inventor holds 3 USPTO granted patents. Top assignees: Daimler-Benz Ag, Forschungszentrum Julich Gmbh, Temic Telefunken. Active years: 1996-1998.
Location History:
- Brackenheim, DE (1996)
- Ulm, DE (1998)
Company Filing History:
2 out of 1,777 
1 out of 312 
1 out of 1 Years Active: 1996-1998
Title: The Innovative Contributions of Andreas Schuppen
Introduction
Andreas Schuppen is a notable inventor based in Ulm, Germany. He has made significant contributions to the field of semiconductor technology, particularly in the fabrication of heterobipolar transistors. With a total of 3 patents to his name, Schuppen's work has paved the way for advancements in high-frequency electronics.
Latest Patents
Schuppen's latest patents include a layered system with an electrically activatable layer, a method of fabricating a heterobipolar transistor, and a method of fabricating an HBT using differential epitaxy. His innovative approach involves using an emitter mask and an exside-inside spacer structure, allowing for a self-aligned fabrication of an emitter contact and a base contact. The emitter contact layer is made from amorphous silicon. This process is temperature-stable and can be executed at lower implantation energies than conventional methods. As a result, high-quality HBTs can be fabricated, making the method suitable for mass production and capable of achieving high oscillation frequencies.
Career Highlights
Throughout his career, Schuppen has worked with prominent companies such as Daimler-Benz AG and Temic Telefunken. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.
Collaborations
Some of Schuppen's notable coworkers include Harry Dietrich and Ulf König. Their collaboration has likely fostered an environment of innovation and creativity in their respective projects.
Conclusion
Andreas Schuppen's contributions to the field of semiconductor technology and his innovative patents highlight his role as a significant inventor. His work continues to influence advancements in high-frequency electronics and semiconductor fabrication.