This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Intel Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Andrea Nicolas Flores: Innovations in Micro-LED Packaging
Introduction
Andrea Nicolas Flores is an inventor associated with Chandler, Arizona, and Intel Corporation. Her patent work includes an approach to integrating micro light-emitting diodes into an integrated circuit package.
Latest Patents
Flores is credited with 1 patent: “IC Package with Micro LEDs.” The patent describes an integrated circuit package containing a semiconductor die with a micro LED, a glass substrate, and a package substrate. The die is at least partially embedded in the glass substrate, which contains a through-glass via electrically coupled to the die to provide power to the micro LED. The package substrate is coupled to the via.
Career Highlights
Flores’s disclosed invention focuses on combining micro-LED technology with semiconductor packaging. Its design uses a through-glass via to connect the embedded die to the package substrate, providing a pathway for electrical power.
Collaborations
The provided information lists Jacob Vehonsky and Onur Ozkan as Flores’s coworkers. Their names are associated with her professional context, though specific contributions to the patent are not provided.
Conclusion
Andrea Nicolas Flores’s patent describes a semiconductor package that integrates a micro LED with glass-substrate and through-glass-via technology, reflecting her contribution to innovation in electronic packaging.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile