An-Nong Wen

Title: **An-Nong Wen: Innovator in Semiconductor Technology**

Introduction

An-Nong Wen is a notable inventor based in Kaohsiung, Taiwan, renowned for his contributions to the field of semiconductor technology. With a total of three patents to his name, he has established himself as a prominent figure in the industry.

Latest Patents

Among his latest innovations is a semiconductor package and method for manufacturing the same. This patent features a semiconductor package that includes a first die with a first surface and a first conductive bump characterized by specific heights and widths. The configuration ensures that the first width exceeds the second width while maintaining a height consistency between the first height and the second height. This innovative method not only provides a unique structure for semiconductor packaging but also describes the manufacturing process involved.

Career Highlights

An-Nong Wen has had a distinguished career, particularly through his tenure at Advanced Semiconductor Engineering, Inc. Here, he played a pivotal role in advancing semiconductor packaging technologies, contributing to the refinement of designs that improve performance and reduce costs.

Collaborations

Throughout his career, An-Nong has collaborated with talented individuals, including coworkers such as Ching-Han Huang and Ching-Ho Chang. These partnerships have facilitated the exchange of ideas and fostered innovation in semiconductor solutions.

Conclusion

An-Nong Wen's ongoing commitment to innovation in semiconductor technology, as evidenced by his patents and collaborative efforts, marks him as a significant inventor in the field. His work continues to impact the industry, paving the way for advancements in semiconductor solutions.