Irvine, CA, United States of America

Alexandra Efimovskaya

This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: University of California. Active years: 2017-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alexandra Efimovskaya. Retrieved from https://idiyas.com/inventor/alexandra-efimovskaya

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 2.4

ph-index = 1


Company Filing History:


Years Active: 2017-2019

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2 patents (USPTO):Explore Patents

Title: Innovations of Alexandra Efimovskaya

Introduction

Alexandra Efimovskaya is a prominent inventor based in Irvine, CA (US). She has made significant contributions to the field of MicroElectroMechanical Systems (MEMS) with her innovative approaches to packaging and interconnects. With a total of 2 patents, her work is paving the way for advancements in MEMS technology.

Latest Patents

One of her latest patents is titled "Low cost wafer level process for packaging MEMS three dimensional devices." This patent presents an apparatus and method for wafer-level hermetic packaging of MEMS devices of various shapes and form factors. The method involves bonding a glass cap wafer with fabricated micro-glassblown 'bubble-shaped' structures to the substrate glass/Si wafer. Metal traces on the substrate wafer facilitate signal transfer from the sealed cavity of the bubble to the outside world. This innovative packaging method utilizes a micro glass-blowing process to create 'bubble-shaped' glass lids, which are essential for vacuum packaging of three-dimensional MEMS devices.

Another significant patent is "Through-wafer interconnects for MEMS double-sided fabrication process (TWIDS)." This invention provides a high-aspect ratio low resistance through-wafer interconnect for double-sided fabrication of MEMS. It serves as an interconnection method and structure for co-integration of MEMS and integrated circuits or other microcomponents utilizing both sides of the wafer. The TWIDS method applied to a three-dimensional folded TIMU (timing inertial measurement unit) enables electrical signals to travel from sensors on the front side of the SOI wafer to electronic components on the back side, while allowing for the folding of an array of sensors into a three-dimensional shape.

Career Highlights

Alexandra is affiliated with the University of California, where she continues to push the boundaries of MEMS technology. Her innovative work has garnered attention in the field, showcasing her expertise and dedication to advancing engineering solutions.

Collaborations

Some of her notable coworkers include Andrei A Shkel and Doruk Senkal, who contribute to her research and development efforts in MEMS technology.

Conclusion

Alexandra Efimovskaya's contributions to MEMS technology through her patents and innovative methods are noteworthy. Her work not only enhances the functionality of MEMS devices but also sets a foundation for future advancements in the

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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