The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Feb. 14, 2017
The Regents of the University of California, Oakland, CA (US);
Andrei A. Shkel, Irvine, CA (US);
Alexandra Efimovskaya, Irvine, CA (US);
Doruk Senkal, Irvine, CA (US);
The Regents of the University of California, Oakland, CA (US);
Abstract
An apparatus and method for wafer-level hermetic packaging of MicroElectroMechanical Systems (MEMS) devices of different shapes and form factors is presented in this disclosure. The method is based on bonding a glass cap wafer with fabricated micro-glassblown 'bubble-shaped' structures to the substrate glass/Si wafer. Metal traces fabricated on the substrate wafer serve to transfer signals from the sealed cavity of the bubble to the outside world. Furthermore, the method provides for chip-level packaging of MEMS three dimensional structures. The packaging method utilizes a micro glass-blowing process to create 'bubbleshaped' glass lids. This new type of lids is used for vacuum packaging of three dimensional MEMS devices, using a standard commercially available type of package.