Munich, Germany

Alexander Schmajew

This inventor holds 4 USPTO granted patents and 2 published patent applications and 1 EPO patent. Top assignees: Epcos Ag, Rf360 Singapore Pte. Ltd.. Active years: 2014-2024.

USPTO Granted Patents = 4 

% Patents Active = 50.0

 

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Location History:

  • München, DE (2014)
  • Munich, DE (2014 - 2024)

Company Filing History:


Years Active: 2014-2024

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4 patents (USPTO):Explore Patents

Title: Innovations by Alexander Schmajew

Introduction

Alexander Schmajew is a notable inventor based in Munich, Germany. He has made significant contributions to the field of electrical devices, holding a total of four patents. His work focuses on innovative packaging solutions for electronic components.

Latest Patents

One of his latest patents is titled "Package for Electric Device and Method of Manufacturing the Package." This invention proposes a package based on a substrate that includes at least a piezoelectric layer. The device structures are enclosed within a cavity of an integrally formed package layer structure, which is a thin film package applied to the first surface of the substrate. The design includes a first contact pad on the first surface, electrically connected to the device structures, and a second contact pad on the opposite surface. Additionally, a via is guided through the substrate to interconnect the first and second contact pads. This innovative packaging allows for stacking and connecting multiple substrates, enhancing the functionality of electronic devices.

Another significant patent is the "Method for Connecting a Plurality of Unpackaged Substrates." This invention describes a method for connecting multiple unpackaged substrates that contain integrated circuits. The design features stepped structures that run between the integrated circuits, with conductor tracks extending from contact connections to these structures. The first substrate can be severed into multiple pieces, each containing an integrated circuit, while maintaining accessibility to the conductor tracks.

Career Highlights

Throughout his career, Alexander Schmajew has worked with prominent companies such as Epcos AG and RF360 Singapore Pte. Ltd. His experience in these organizations has contributed to his expertise in developing innovative solutions for electronic packaging.

Collaborations

Some of his notable coworkers include Hans Krueger and Alois Stelzl. Their collaboration has likely fostered an environment of creativity and innovation in their respective projects.

Conclusion

Alexander Schmajew's contributions to the field of electrical device packaging demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in electronic design and manufacturing.

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