The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 16, 2024
Filed:
Mar. 28, 2019
Rf360 Singapore Pte. Ltd., Singapore, SG;
Alexander Schmajew, Munich, DE;
RF360 SINGAPORE PTE. LTD., Singapore, SG;
Abstract
A package for an electric device is proposed based on a substrate (SU, SU, SU) that comprises at least a piezoelectric layer. Device structures are enclosed in a cavity of an integrally formed package layer structure (PK) of a thin film package applied on the first surface (SI). A first contact pad (PI) is arranged on the first surface of the substrate and electrically connected to the device structures. A second contact pad (P) is arranged on a second surface (S) of the substrate opposite to the first surface (SI). A via (V) is guided through the substrate and interconnects first and second contact pads electrically. Packages may be stacked on one another and connected via two pads of different kind. The first substrate (SU) is connected via its second pad (P) on the second surface thereof to the first pad of a second substrate (SU) by means of connection means (CM).