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For the Inventor, By the Inventor

Ebersbach, Germany

Alexander Platz

USPTO Granted Patents = 4 


Average Co-Inventor Count = 3.6

ph-index = 4

Forward Citations = 19(Granted Patents)


Location History:

  • Moritzburg, DE (2009 - 2010)
  • Ebersbach, DE (2011 - 2013)

Company Filing History:

goldMedal2 out of 5,671 
 
Globalfoundries Inc.
 patents
silverMedal2 out of 12,883 
 
Advanced Micro Devices Corporation
 patents

Years Active: 2009-2013

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4 patents (USPTO):Explore Patents
1. 8580672 - Methods of forming bump structures that include a protection layer (2013-11-12),
2. 8039958 - Semiconductor device including a reduced stress configuration for metal pillars (2011-10-18),
3. 7829453 - Method for forming solder balls with a stable oxide layer by controlling the reflow ambient (2010-11-09),
4. 7585759 - Technique for efficiently patterning an underbump metallization layer using a dry etch process (2009-09-08),
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