The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 12, 2013

Filed:

Oct. 25, 2011
Applicants:

Frank Kuechenmeister, Dresden, DE;

Lothar Lehmann, Radebeul, DE;

Alexander Platz, Ebersbach, DE;

Gotthard Jungnickel, Radeberg, DE;

Sven Kosgalwies, Dresden, DE;

Inventors:

Frank Kuechenmeister, Dresden, DE;

Lothar Lehmann, Radebeul, DE;

Alexander Platz, Ebersbach, DE;

Gotthard Jungnickel, Radeberg, DE;

Sven Kosgalwies, Dresden, DE;

Assignee:

GLOBALFOUNDRIES Inc., Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

One illustrative method disclosed herein includes forming a conductive pad in a layer of insulating material, forming a passivation layer above the conductive pad, performing at least one etching process on the passivation layer to define an opening in the passivation layer that exposes at least a portion of the conductive pad, forming a protective layer on the passivation layer, in the opening and on the exposed portion of the conductive pad, forming a heat-curable material layer above the protective layer, performing an etching process to define a patterned heat-curable material layer having an opening that exposes a portion of the protective layer, performing an etching process on the protective layer to thereby expose at least a portion of the conductive pad and forming a conductive bump that is conductively coupled to the conductive pad.


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