The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2009
Filed:
May. 08, 2006
Frank Kuechenmeister, Dresden, DE;
Alexander Platz, Moritzburg, DE;
Gotthard Jungnickel, Radeberg, DE;
Kerstin Siury, Dresden, DE;
Frank Kuechenmeister, Dresden, DE;
Alexander Platz, Moritzburg, DE;
Gotthard Jungnickel, Radeberg, DE;
Kerstin Siury, Dresden, DE;
Advanced Micro Devices, Inc., Austin, TX (US);
Abstract
By patterning the underbump metallization layer stack on the basis of a dry etch process, significant advantages may be achieved compared to conventional techniques involving a highly complex wet chemical etch process. In particular embodiments, a titanium tungsten layer or any other appropriate last layer of an underbump metallization layer stack may be etched on the basis of a plasma etch process using a fluorine-based chemistry and oxygen as a physical component. Moreover, appropriate cleaning processes may be performed for removing particles and residues prior to and after the plasma-based patterning process.