Vancouver, Canada

Alexander John Cochran

This inventor holds 1 USPTO granted patent. Top assignee: Pmc-Sierra, Inc.. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alexander John Cochran. Retrieved from https://idiyas.com/inventor/alexander-john-cochran

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Alexander John Cochran: FIFO Buffer Innovation

Introduction

Alexander John Cochran is an inventor associated with Vancouver, Canada, and Pmc-Sierra, Inc. His patent work addresses FIFO buffer management for asynchronous data payloads.

Latest Patents

Cochran is associated with 1 patent: “FIFO Buffer Depth Estimation for Asynchronous Gapped Payloads.” The invention continuously derives a desired FIFO buffer fill level while mapping or demapping plesiosynchronous data signals to synchronized data signals, or vice versa. It calculates the difference between bits written and bits read, then uses that gap pattern with a predefined center fill level to estimate the desired buffer fill level.

Career Highlights

Cochran’s patent reflects work on estimating and maintaining FIFO buffer depth in data-processing systems. The method accounts for variations in the number of bits read and written across consecutive clock cycles.

Collaborations

Cochran’s listed coworkers include Patrick Neil Bailey and Larrie Simon Carr. The available information identifies his association with Pmc-Sierra, Inc., but does not specify the coworkers’ roles in the patent.

Conclusion

Alexander John Cochran’s patent describes a method for estimating FIFO buffer fill levels amid asynchronous, gapped data flows, highlighting his contribution to data-buffering technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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