Alex Capanzana

Title: Alex Capanzana: Advancing Metal-Coated Substrates

Introduction

Alex Capanzana is an inventor based in San Jose, California, and works at Kuprion Inc. His patent work addresses methods for producing metal-coated substrates and interposers, with potential applications in advanced materials and electronic packaging.

Latest Patents

Capanzana is named on 1 patent: “Metal-Coated Substrates, Interposers, and Methods for Production Thereof.” The invention describes introducing a seed layer onto a base substrate, mechanically polishing that layer, and then forming a metal layer over it. The base substrate may be ceramic, such as silicon nitride or aluminum nitride, or may consist of polymer, silicon, metal, or glass.

The process can make an initially non-conductive seed layer electrically conductive through mechanical polishing. A metal layer may then be formed by depositing a composition containing metal nanoparticles and consolidating the particles, for example, through hot pressing. Additives in the composition may help match the metal layer’s coefficient of thermal expansion (CTE) to that of the base substrate.

Career Highlights

Capanzana’s patent reflects work on substrate metallization, combining surface preparation with nanoparticle-based metal formation. The described approach focuses on producing metal layers while accounting for compatibility between the coating and its underlying material.

Collaborations

Capanzana’s listed coworker is Hannah Thanh Zinn. Both are associated with Kuprion Inc., the company connected with the patent.

Conclusion

Alex Capanzana’s patent presents a method for creating metal-coated substrates and interposers through seed-layer polishing and metal nanoparticle consolidation, with attention to matching the coating’s thermal expansion to the base material.