For the Inventor, By the Inventor

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San Jose, CA, United States of America

Kuprion Inc.

USPTO Granted Patents = 22

EPO Patents = 1

Trademarks = 1

Forward Citations = 3

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15 inventors (with patents filed for the assignee):

Alfred A Zinn (22 out of 55 patents)

Chee Lip Gan (4 out of 7 patents)

Yeng Ming Lam (4 out of 6 patents)

4. Randall M Stoltenberg (4 out of 4 patents)

5. Khanh Nguyen (3 out of 5 patents)

6. Byung Hoon Lee (2 out of 4 patents)

7. Zhenggang Li (2 out of 2 patents)

8. Jaewon Kim (2 out of 2 patents)

9. Gilman Louie (1 out of 2 patents)

10. Rachel Brody (1 out of 1 patent)

11. Nhi Ngo (1 out of 1 patent)

12. Alex Capanzana (1 out of 1 patent)

13. Hannah Thanh Zinn (1 out of 1 patent)

14. Nicholas Antonopoulos (1 out of 1 patent)

15. Robert Roth (1 out of 1 patent)

22 patents: Sort by Forward Citations

1. 12720675 - Metal-coated substrates, interposers, and methods for production thereof (2026-08-25),

2. 12713527 - CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTICLES (2026-08-18),

3. 12667144 - Protective coverings and dry wipes comprising metal nanoparticle agglomerates for infection control applications and formation and use thereof (2026-06-30),

4. 12595379 - Articles coated with metal nanoparticle agglomerates (2026-04-07),

5. 12543807 - Garments, gloves and personal protective equipment enchanced with metal nanoparticle agglomerates (2026-02-10),

6. 12514874 - Antiseptic applications of metal nanoparticle agglomerates (2026-01-06),

7. 12447562 - Nanoparticle paste compositions and connections formed therefrom (2025-10-21),

8. 12426148 - Thermal management in circuit board assemblies (2025-09-23),

9. 12357932 - Air filtration media having metal nanoparticle agglomerates adhered thereto, formation thereof and use thereof (2025-07-15),

10. 12230596 - Electronics assemblies employing copper in multiple locations (2025-02-18),

11. 12091567 - Ink composition, method for forming a conductive member, and conductive device (2024-09-17),

12. 12016118 - Ceramic-based circuit board assemblies formed using metal nanoparticles (2024-06-18),

13. 11910520 - Thermal management in circuit board assemblies (2024-02-20),

14. 11735548 - Electronics assemblies employing copper in multiple locations (2023-08-22),

15. 11503700 - Thermal management in circuit board assemblies (2022-11-15),

Kuprion Inc. is a leading provider of innovative technology solutions for businesses worldwide. With a focus on delivering cutting-edge solutions in the fields of artificial intelligence, cloud computing, and data analytics, Kuprion Inc. helps organizations harness the power of technology to drive growth and success.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Sep 29 2026

22 Patents

#327 in San Jose, CA

#3,582 in California

#15,012 in US

#28,724 in the World

San Jose, CA, United States of America

Kuprion Inc.

Forward Citations = 3

15 inventors:

Alfred A Zinn (22 out of 55 patents)

Chee Lip Gan (4 out of 7 patents)

Yeng Ming Lam (4 out of 6 patents)

4. Randall M Stoltenberg (4 out of 4 patents)

5. Khanh Nguyen (3 out of 5 patents)

Please report any incorrect information to [email protected]

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