For the Inventor, By the Inventor

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San Jose, CA, United States of America

Kuprion Inc.

USPTO Granted Patents = 22

EPO Patents = 1

Trademarks = 1

Forward Citations = 3

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15 inventors (with patents filed for the assignee):

Alfred A Zinn (22 out of 55 patents)

Chee Lip Gan (4 out of 7 patents)

Yeng Ming Lam (4 out of 6 patents)

4. Randall M Stoltenberg (4 out of 4 patents)

5. Khanh Nguyen (3 out of 5 patents)

6. Byung Hoon Lee (2 out of 4 patents)

7. Zhenggang Li (2 out of 2 patents)

8. Jaewon Kim (2 out of 2 patents)

9. Gilman Louie (1 out of 2 patents)

10. Rachel Brody (1 out of 1 patent)

11. Nhi Ngo (1 out of 1 patent)

12. Alex Capanzana (1 out of 1 patent)

13. Hannah Thanh Zinn (1 out of 1 patent)

14. Nicholas Antonopoulos (1 out of 1 patent)

15. Robert Roth (1 out of 1 patent)

22 patents: Sort by Forward Citations

1. 12720675 - Metal-coated substrates, interposers, and methods for production thereof (2026-08-25),

2. 12713527 - CERAMIC-BASED CIRCUIT BOARD ASSEMBLIES FORMED USING METAL NANOPARTICLES (2026-08-18),

3. 12667144 - Protective coverings and dry wipes comprising metal nanoparticle agglomerates for infection control applications and formation and use thereof (2026-06-30),

4. 12595379 - Articles coated with metal nanoparticle agglomerates (2026-04-07),

5. 12543807 - Garments, gloves and personal protective equipment enchanced with metal nanoparticle agglomerates (2026-02-10),

6. 12514874 - Antiseptic applications of metal nanoparticle agglomerates (2026-01-06),

7. 12447562 - Nanoparticle paste compositions and connections formed therefrom (2025-10-21),

8. 12426148 - Thermal management in circuit board assemblies (2025-09-23),

9. 12357932 - Air filtration media having metal nanoparticle agglomerates adhered thereto, formation thereof and use thereof (2025-07-15),

10. 12230596 - Electronics assemblies employing copper in multiple locations (2025-02-18),

11. 12091567 - Ink composition, method for forming a conductive member, and conductive device (2024-09-17),

12. 12016118 - Ceramic-based circuit board assemblies formed using metal nanoparticles (2024-06-18),

13. 11910520 - Thermal management in circuit board assemblies (2024-02-20),

14. 11735548 - Electronics assemblies employing copper in multiple locations (2023-08-22),

15. 11503700 - Thermal management in circuit board assemblies (2022-11-15),

Company Overview

Kuprion Inc., based in San Jose, California, specializes in the development of advanced materials and technologies for various applications, particularly in the fields of healthcare and environmental sustainability. The company focuses on innovative solutions that leverage unique properties of materials to address complex challenges in drug delivery and diagnostics. With a commitment to research and development, Kuprion aims to enhance the efficacy of therapeutic interventions while promoting a sustainable future through its cutting-edge technologies.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

22 Patents

#327 in San Jose, CA

#3,590 in California

#15,051 in US

#28,807 in the World

San Jose, CA, United States of America

Kuprion Inc.

Forward Citations = 3

15 inventors:

Alfred A Zinn (22 out of 55 patents)

Chee Lip Gan (4 out of 7 patents)

Yeng Ming Lam (4 out of 6 patents)

4. Randall M Stoltenberg (4 out of 4 patents)

5. Khanh Nguyen (3 out of 5 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Kuprion Inc.. Retrieved from https://idiyas.com/company/kuprion

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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