The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2026
Filed:
Feb. 15, 2023
Kuprion Inc., Waterbury, CT (US);
Alfred A. Zinn, San Jose, CA (US);
Alex Capanzana, San Jose, CA (US);
Hannah Thanh Zinn, Palo Alto, CA (US);
Kuprion Inc., Waterbury, CT (US);
Abstract
Substrates may be metallized by introducing a seed layer upon a base substrate, mechanically polishing the seed layer, and forming a metal layer upon the seed layer after mechanical polishing. The base substrate may comprise a ceramic, such as silicon nitride or aluminum nitride, a polymer, silicon, metal, or glass. The seed layer optionally may be rendered electrically conductive by mechanical polishing of an initially non-conductive seed layer. The metal layer may be formed by depositing a metal nanoparticle composition upon the seed layer after mechanical polishing and consolidating metal nanoparticles therein, such as through a hot pressing operation. The metal nanoparticle composition may contain one or more additives that facilitate CTE matching of the metal layer to the base substrate.