Akira Ohuchi

Title: Akira Ohuchi: Innovator in Semiconductor Technology

Introduction

Akira Ohuchi is a prominent inventor based in Tokyo, Japan, known for his contributions to semiconductor technology. With a total of two patents to his name, he has made significant advancements in the field, particularly in the design and manufacturing of semiconductor devices.

Latest Patents

Ohuchi's latest patents include a semiconductor device and manufacturing method that features electrode pads and solder resist on the upper surface of a wiring board. The design incorporates apertures in the solder resist to expose the electrode pads, allowing for efficient connections. Additionally, electrodes on the lower surface of a semiconductor element are connected to these pads via bumps, with an underfill resin strategically placed to enhance reliability. His second patent focuses on a packaging method and structures for semiconductor devices that are reworkable even after formal curing. This innovation ensures good connection reliability while addressing thermal expansion issues between the semiconductor device and the substrate.

Career Highlights

Ohuchi is currently employed at NEC Corporation, where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing methods that improve the performance and reliability of semiconductor devices.

Collaborations

Ohuchi collaborates with Tomoo Murakami, a talented engineer who contributes to the innovative projects at NEC Corporation.

Conclusion

Akira Ohuchi's work in semiconductor technology exemplifies the spirit of innovation and dedication to advancing the field. His patents reflect a deep understanding of the complexities involved in semiconductor manufacturing, making him a key figure in this industry.