The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2003
Filed:
Aug. 01, 2001
Akira Ohuchi, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A packaging structure and a packaging method reworkable even after the formal curing and good in connection reliability, characterized in that an electrode of a semiconductor device and an electrode of a substrate are electrically connected via bumps a first resin decreasing in mechanical strength and becoming reworkable under given conditions and a second resin capable of mitigating the stress due to a difference in thermal expansion coefficient between the semiconductor device and the substrate and superior in mechanical strength to the first resin under the given conditions are stacked and formed in the gap between the semiconductor device and the substrate and moreover the first resin is formed at a thickness of less than a half of said gap in total on the surface of at least either of the semiconductor device and the substrate