The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2011
Filed:
Jan. 12, 2005
Akira Ohuchi, Tokyo, JP;
Tomoo Murakami, Tokyo, JP;
Akira Ohuchi, Tokyo, JP;
Tomoo Murakami, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
Electrode pads () and a solder resist () are disposed on the upper surface of a wiring board (), and apertures () are formed in the solder resist () so as to expose the electrode pads (). Electrodes () are disposed on the lower surface of a semiconductor element (). Electrodes () are connected to the electrode pads () by way of bumps (). An underfill resin () is disposed in the area that excludes the solder resist () and the bumps () in the space between the wiring board () and the semiconductor element (). Between the wiring board () and the semiconductor element (), the thickness (B) of the solder resist () is equal to or greater than the thickness (A) of the underfill resin () on the solder resist (). The volume (Vb) of the bumps () is less than the volume (Vs) of the apertures ().