Akira Oga

USPTO Granted Patents = 9 (Patent Applications = 2)

EPO Patents = 1

Average Co-Inventor Count = 2.9

ph-index = 5

Forward Citations = 355(Granted Patents)

Location History:

Otsu, JP (2003 - 2004)
Kadoma, JP (2009)
Shiga, JP (1998 - 2011)

Company Filing History:

3 out of 655

Matsushita Electronics Corporation

patents

3 out of 27,375

Matsushita Electric Industrial Co., Ltd.

patents

3 out of 16,453

Panasonic Corporation

patents

Years Active: 1998-2011

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9 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 8039932 - Lead frame, semiconductor device, method of manufacturing the lead frame, and method of manufacturing the semiconductor device (2011-10-18),

2. D600219 - Lead frame (2009-09-15),

3. 7508055 - High heat release semiconductor and method for manufacturing the same (2009-03-24),

4. 6984880 - Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device (2006-01-10),

5. 6720207 - Leadframe, resin-molded semiconductor device including the leadframe, method of making the leadframe and method for manufacturing the device (2004-04-13),

6. 6645792 - Lead frame and method for fabricating resin-encapsulated semiconductor device (2003-11-11),

7. 6225146 - Lead frame, method of manufacturing lead frame, semiconductor device and method of manufacturing semiconductor device (2001-05-01),

8. 5977615 - Lead frame, method of manufacturing lead frame, semiconductor device and (1999-11-02),

9. 5708295 - Lead frame and method of manufacturing the same, and resin sealed (1998-01-13),

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2 patents pending:

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1 patent (EPO):

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