The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2003
Filed:
Dec. 11, 2001
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
The lead frame of the present invention is a lead frame used in resin encapsulation of a semiconductor chip using an encapsulation mold that includes a die cavity to be filled with an encapsulation resin, the lead frame including: a first region exposed to the die cavity; a second region that is surrounding the first region and to be clamped by the encapsulation mold; a third region exposed to an ambient air with the die cavity being filled with the encapsulation resin; and at least one groove formed on a surface of the lead frame that is opposite to another surface of the lead frame on which the first region is present, the at least one groove extending from an area corresponding to the first region across another area corresponding to the second region so as to reach the third region.