The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 24, 2009
Filed:
Jan. 14, 2005
Yutaka Katou, Osaka, JP;
Akira Oga, Shiga, JP;
Shuichi Ogata, Osaka, JP;
Hideki Sakoda, Kyoto, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A semiconductor device includes a die pad of a conductive material, a quadrilateral semiconductor element mounted on the die pad, a plurality of suspension members of the conductive material extending outward from the die pad, a plurality of leads of the conductive material provided between adjacent two of the suspension members and each having a lead end opposed to the semiconductor element, a plurality of thin conductive wires through which the semiconductor element is connected to the leads, respectively, an encapsulant for encapsulating the die pad, the semiconductor element, the suspension members, parts of the leads and the thin conductive wires, and a grounding lead of the conductive material extending from at least one of the suspension members and provided, in part, between one and another of the leads.