Akira Ichiryu

Title: Akira Ichiryu: Innovator in Printed Wiring Board Technology

Introduction

Akira Ichiryu is a notable inventor based in Ageo, Japan. He has made significant contributions to the field of printed wiring board technology, holding a total of 3 patents. His innovative approaches have paved the way for advancements in electronic components.

Latest Patents

Ichiryu's latest patents include a process for producing a collapsed filled via hole. This process involves creating a printed wiring board-forming sheet that consists of a resin sheet with a through hole and a metal chip inserted into it. The method allows for electrical connections between the front and back surfaces of the sheet, facilitating the production of multi-layer boards. Another significant patent is related to a dielectric filler containing resin for the formation of a built-in capacitor layer in printed wiring boards. This invention enables the creation of a dielectric layer without the need for a skeletal material, providing high strength and flexibility in thickness.

Career Highlights

Throughout his career, Ichiryu has worked with prominent companies such as Mitsui Mining & Smelting Company, Ltd. and Suzuki Co., Ltd. His experience in these organizations has contributed to his expertise in the field of electronics and materials science.

Collaborations

Ichiryu has collaborated with notable coworkers, including Masahito Ishii and Toshiyuki Nakamura. These partnerships have likely enhanced his innovative capabilities and broadened his impact on the industry.

Conclusion

Akira Ichiryu's contributions to printed wiring board technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials and processes that are essential for advancing electronic components.