Mitsui Minings & Melting Co., Ltd.

Other

Suzuki Co., Ltd.

Akira Ichiryu

Masahito Ishii

Tetsuro Sato

Toshifumi Matsushima

Tatsuo Kataoka

Fujio Kuwako

Katsuhiko Hayashi

Kazuhiro Yamazaki

Hideto Tanaka

Motonobu Takahashi

Daisuke Arai

Hideaki Miwa

Hirokazu Kawamura

Toshiyuki Nakamura

A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole in the resin sheet and inserting the punched conductive metal chip in the through hole of the resin sheet whereby the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet, and if a large number of such substrates are laminated, electrical connection in the thickness direction can readily be made by virtue of the protruded conductive metal chips and a multi-layer board can be readily produced.

Process for producing a collapsed filled via hole

An object is to provide a dielectric layer of a double-sided copper clad laminate, for use in formation of a built-in capacitor layer, which can be formed in an optional thickness without using a skeletal material and is provided with a high strength. For the purpose of achieving the object, 'a dielectric filler containing resin for use in formation of the built-in capacitor layer of a printed wiring board obtained by mixing a binder resin comprising 20 to 80 parts by weight of epoxy resin (inclusive of a curing agent), 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer, and a curing accelerator added in an appropriate amount according to need; and a dielectric filler which is a nearly spherical dielectric powder having perovskite structure which is 0.1 to 1.0 &#x3bc;m in the average particle size D, 0.2 to 2.0 &#x3bc;m in the weight cumulative particle size Dbased on the laser diffraction scattering particle size distribution measurement method, and 4.5 or less in the coagulation degree represented by D/Dwhere the weight cumulative particle size Dand the average particle size Dobtained by the image analysis'; and the like are used.

DIELECTRIC FILLER CONTAINING RESIN FOR USE IN FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD AND DOUBLE-SIDED COPPER CLAD LAMINATE WITH DIELECTRIC LAYER FORMED USING THE SAME DIELECTRIC FILLER CONTAINING RESIN, AND PRODUCTION METHOD OF DOUBLE-SIDED COPPER CLAD LAMINATE

A 2-metal layer TAB and a both-sided CSP.BGA tape having an insulating substrate and a wiring layer provided on at least both sides of the substrate, the substrate having evenly spaced sprocket holes on both width direction edges in the longitudinal direction thereof and also having through-holes formed with a punching press, and the through-holes being filled with a conductor by means of a punching press such that the conductor and the wiring layers are electrically connected, which is characterized by having round pilot holes between the sprocket holes formed in the longitudinal direction thereof; and a process of producing the same.

2-Metal layer TAB tape and both-sided CSP&bull;BGA tape

Growing community of inventors

Ageo, Japan

Akira Ichiryu