The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 20, 2007
Filed:
Dec. 04, 2003
Toshiyuki Nakamura, Suzaka, JP;
Hideto Tanaka, Suzaka, JP;
Akira Ichiryu, Ageo, JP;
Motonobu Takahashi, Ageo, JP;
Masahito Ishii, Hino, JP;
Daisuke Arai, Ageo, JP;
Toshiyuki Nakamura, Suzaka, JP;
Hideto Tanaka, Suzaka, JP;
Akira Ichiryu, Ageo, JP;
Motonobu Takahashi, Ageo, JP;
Masahito Ishii, Hino, JP;
Daisuke Arai, Ageo, JP;
Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;
Suzuki Co., Ltd., Nagano, JP;
Abstract
A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole in the resin sheet and inserting the punched conductive metal chip in the through hole of the resin sheet whereby the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet, and if a large number of such substrates are laminated, electrical connection in the thickness direction can readily be made by virtue of the protruded conductive metal chips and a multi-layer board can be readily produced.