Akio Nishikawa

This inventor holds 15 USPTO granted patents, primarily in Semiconductor Packaging. Top assignees: Hitachi, Ltd., Hitachi Chemical Company, Ltd.. Active years: 1976-1993.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akio Nishikawa. Retrieved from https://idiyas.com/inventor/akio-nishikawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

USPTO Granted Patents = 15

% Patents Active = 100.0

Average Co-Inventor Count = 4.8

ph-index = 8

Forward Citations = 230(Granted Patents)

Location History:

Hitachi, JA (1976 - 1977)
Ibaraki, JP (1981)
Hitachi, JP (1978 - 1993)

Company Filing History:

Hitachi Chemical Company, Ltd.

patents

where one patent can have more than one assignee

Years Active: 1976-1993

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Areas of Expertise:

Resin Composition

Semiconductor Encapsulation

Polymer Process

Thermosetting Resin

Epoxy Compound

Nitrile Terminated Compounds

Dihydropyridine Rings

Electric Apparatus

Memory Shielding

Pressure Molding

15 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 5225499 - Resin composition for encapsulating of semiconductor and semiconductor (1993-07-06),

2. 5166283 - Polymer having dihydropyridine rings or dihydrotriazine rings, process (1992-11-24),

3. 4900807 - Polymer from nitrile terminated compounds having Schiff bonds and (1990-02-13),

4. 4758875 - Resin encapsulated semiconductor device (1988-07-19),

5. 4562322 - SF.sub.6 Gas arc extinguishing electric apparatus and process for (1985-12-31),

6. 4494217 - Semiconductor memories with .alpha. shield (1985-01-15),

7. 4460783 - Ether imides and process for producing the same (1984-07-17),

8. 4435560 - Maleimide: aryloxy diamine resin composition and process for producing (1984-03-06),

9. 4296219 - Bismide-ether compounds, compositions thereof, and method of producing (1981-10-20),

10. 4278780 - Thermosetting resin composition comprising epoxy compound and reaction (1981-07-14),

11. 4211686 - Unsaturated polyester resin composition for use in pressure molding (1980-07-08),

12. 4138372 - Resin compositions containing polyepoxides and uretdiones (1979-02-06),

13. 4128527 - Dynamoelectric machine having coil windings and core encapsulated with (1978-12-05),

14. 4056579 - Novel thermosetting resin composition and cured product therefrom (1977-11-01),

15. 3963796 - Epoxy resin composition having excellent latent hardening characteristics (1976-06-15),

Title: The Innovations of Akio Nishikawa: A Pioneer in Semiconductor Encapsulation

Introduction: Akio Nishikawa, a distinguished inventor based in Hitachi, Japan, has made significant contributions to the field of semiconductor technology. With a remarkable portfolio of 15 patents, Nishikawa's work stands at the intersection of materials science and electronics, pushing the boundaries of what is possible in semiconductor encapsulation.

Latest Patents: Among his latest innovations, Nishikawa has developed a revolutionary resin composition specifically designed for the encapsulation of semiconductors. This advanced resin composition boasts superior molding characteristics, excellent bonding capabilities, and enhanced moisture and heat resistance. Central to this invention is a polymer featuring dihydropyridine rings or dihydrotriazine rings. The process involves creating a polymer that utilizes an ethynyl- or cyanato-terminated Schiff's compound as a key starting material. This innovation has significant implications for improving the reliability and performance of semiconductor devices.

Career Highlights: Throughout his career, Akio Nishikawa has held prominent positions at several leading companies, notably Hitachi, Ltd. and Hitachi Chemical Company, Ltd. His work at these organizations has allowed him to focus on advancing semiconductor encapsulation technologies and materials. Nishikawa's consistent dedication to innovation has placed him among the notable figures in the field.

Collaborations: Collaboration has played a crucial role in Nishikawa’s achievements. He has worked alongside talented colleagues such as Hiroshi Suzuki and Hitoshi Yokono. Their combined expertise has facilitated the exploration and development of new materials and technologies, further enhancing the impact of Nishikawa's work in the industry.

Conclusion: Akio Nishikawa’s contributions to semiconductor technology are invaluable. His innovative resin compositions and dedication to improving encapsulation methods have established him as a leading inventor in the field. With a legacy of excellence exemplified through 15 patents, Nishikawa continues to inspire future innovations in semiconductor applications.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]