The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 1993
Filed:
Mar. 01, 1991
Applicant:
Inventors:
Hiroyoshi Kokaku, Hitachi, JP;
Masatsugu Ogata, Hitachi, JP;
Masanori Segawa, Hitachi, JP;
Hiroshi Hozoji, Hitachi, JP;
Akio Nishikawa, Hitachi, JP;
Fumio Sato, Hitachi, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F / ;
U.S. Cl.
CPC ...
525530 ; 525508 ; 257788 ;
Abstract
A resin composition having superior molding character, bonding character, moisture resistance, and heat resistance, for encapsulating of a semiconductor which contains:
Kokaku, Hiroyoshi. (1993). Resin composition for encapsulating of semiconductor and semiconductor (U.S. Patent No. 5225499). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5225499
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile