Hitachi, Ltd.

Hitachi Chemical Company, Ltd.

Akio Nishikawa

Hitoshi Yokono

Hiroshi Suzuki

Junji Mukai

Akio Takahashi

Toshikazu Narahara

Noriyuki Kinjo

Hirosada Morishita

Mikio Sato

Daisuke Makino

Junichi Katagiri

Hideki Asano

Hisashi Kohkame

Tsuguo Kobayashi

Tamotsu Ikeda

Hiroshi Hozoji

Yasuo Miyadera

Hiroyoshi Kokaku

Motoyo Wajima

Masatsugu Ogata

Masanori Segawa

Shunichi Numata

Koji Fujisaki

Kunio Hirasawa

Susumu Era

Tohru Koyama

Yoshiaki Wakashima

Toru Koyama

Yoshio Yoshioka

Ritsuro Tada

Fumio Sato

Motoo Yamaguchi

Yutaka Itoh

Takeshi Komaru

Masashi Shitara

Shun-ichi Numata

Masao Hosokawa

Goro Tanaka

Isamu Sone

Ryuichi Simizu

Toshiaki Fukushima

Moloyo Wajima

A resin composition having superior molding character, bonding character, moisture resistance, and heat resistance, for encapsulating of a semiconductor which contains:

Resin composition for encapsulating of semiconductor and semiconductor

A polymer having dihydropyridine rings or dihydrotriazine rings as main constitutional units, an ethynyl- or cyanato-terminated Schiff's compound which is a starting material for producing the polymer, and applications of the polymer.

Polymer having dihydropyridine rings or dihydrotriazine rings, process

There are disclosed a nitrile-terminated Schiff compound represented by the formula X--Z--Y--C.tbd.N).sub.m (I) wherein n is 1 or 2, Z is --CH.dbd.N-- or --N.dbd.CH-- and Y is a divalent organic group such as phenylene and the like, and X is the same as Y when n=2 or H, lower alkyl group etc. when n=1; polymers obtained by polymerizing said Schiff compound alone or together with other monomers, and a process for preparing such a polymer therefrom.

Polymer from nitrile terminated compounds having Schiff bonds and

Disclosed is a resin encapsulated semiconductor memory device comprising a semiconductor memory element, a package encapsulating the memory element and an .alpha.-rays shielding layer made from a water-resistant aromatic polyimide polymer, interposed between the memory element and the package, the aromatic polyimide polymer having a saturated water absorption rate of 1% or less. The polyimide polymer is exemplified as the polymer having the following recurring units: ##STR1## wherein R is an aliphatic or aromatic group; R.sub.1 and R.sub.2 are independently a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or CF.sub.3 ; and R.sub.3 to R.sub.6 are independently a hydrogen atom, a halogen atom or an alkyl group having 1 to 4 carbon atoms. The disclosure is also concerned with resin encapsulated semiconductor devices in which the aromatic polyimide polymer of low water absorption is used as an insulating layer or passivation film.

Resin encapsulated semiconductor device

A SF.sub.6 gas insulating electric apparatus usable as a circuit breaker, etc., containing a SF.sub.6 gas insulator and a resin insulator, both of which insulators are present in an atmosphere to be exposed to arcs, characterized by making at least the surface portion to be exposed to arcs of the resin insulator from a polymer containing nitrogen atoms or a polyolefin resin, and if necessary together with an inorganic filler powder, is excellent in both surface and inner arc resistance and can maintain breaking performance for a long period of time.

SF.sub.6 Gas arc extinguishing electric apparatus and process for

In a semiconductor memory device comprising semiconductor memory elements having such a degree of integration in memory circuits as to produce soft errors by incident .alpha.-rays derived from a packaging material and a package which packages the memory elements and is made from the packaging material, when an .alpha.-rays shielding layer made from a resinous material, which may contain one or more high-purity fillers, containing a total amount of 1 part per billion or less of uranium and thorium is interposed between the memory elements and the package, the generation of soft errors is reduced remarkably.

Semiconductor memories with .alpha. shield

An ether imide of the formula: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6 and D are as defined in the specification produced by reacting a diamine with an ethylenically unsaturated dicarboxylic acid can give a composition together with one or more unsaturated polyesters, epoxy compounds, amines, and the like to give shaped articles excellent in flexibility and heat resistance.

Ether imides and process for producing the same

The disclosure is concerned with a maleimide-diamine resin composition which is well soluble to a low boiling point solvent and is excellent in heat resistance. The composition is featured by containing a maleimide-diamine adduct having the general formula: ##STR1## wherein A is a mono-, di-, tri- or tetravalent organic group containing at least two carbon atoms, R.sub.1 through R.sub.6 are hydrogen atom, a lower alkyl group, a lower alkoxy group, chlorine atom, bromine atom, trifluoromethyl group, or trichloromethyl group, and m is an integer of 0-4.

Maleimide: aryloxy diamine resin composition and process for producing

A bisimide-ether compound having the general formula is obtained by reacting an ethylenically unsaturated dicarboxylic acid anhydride, a diamine compound and a phenolic compound having in the molecule at least two hydroxyl groups, or by reacting a prepolymer of the anhydride and diamine compound with the phenolic compound: ##STR1## wherein R.sub.1 is a group containing at least two carbon atoms, R.sub.2 is a group containing at least two carbon atoms, R'.sub.2 is a group containing at least two carbon atoms and a carbon-carbon double bond, R.sub.3 is an aromatic group, the nitrogen atoms of the imide rings being directly connected to different carbon atoms of the group R.sub.1, the carbonyl groups of the imide rings being directly connected to different carbon atoms of the group R.sub.2 or R'.sub.2, the oxygen atoms between the groups R.sub.2 and R.sub.3 being directly connected to an aromatic nucleus of the group R.sub.3, and n is an integer of zero, one or more than 1.

Bismide-ether compounds, compositions thereof, and method of producing

A thermosetting resin composition suitable for use as a molding material comprising (a) a reaction product mixture obtained by preferably reacting 1 mole of a dicarboxylic acid anhydride having ethylenic carbon-carbon double bond such as maleic anhydride with 2-20 moles of a diamine such as 4,4'-diaminodiphenylmethane in a molten state and (b) an epoxy compound having more than one 1,2-epoxy group on the average gives a cured product excellent in heat resistance, etc., when cured with heating at a temperature of 150.degree. to 200.degree. C.

Thermosetting resin composition comprising epoxy compound and reaction

An unsaturated polyester resin composition for use in pressure molding, which comprises an unsaturated polyester resin and fillers consisting essentially of (a) calcium carbonate powder which passes a 325 mesh sieve, (b) an inorganic mineral particulate which passes a 12 mesh sieve and is retained on a 200 mesh sieve and (c) glass fibers having a length larger than 0.2 mm, wherein the ratio by weight of (a) to (b) is within a range of from 0.3 to 10, the ratio of (a)+(b) to the unsaturated polyester resin is within a range of from 1.5 to 7, and the ratio of (c) to the total weight of the resin, calcium carbonate, silica sand and glass fiber is within a range of from 0.01 to 0.25.

Unsaturated polyester resin composition for use in pressure molding

A polymerizable, curable resin composition suitable for molding materials, prepreg, powdery paint materials or the like, which comprises a polyepoxide, a uretdione and a tetraphenyl borate-amine complex. This composition has long pot life and good curability by virtue of latent catalytic characteristics of the complex.

Resin compositions containing polyepoxides and uretdiones

In a dynamoelectric machine having a stator assembly of coil windings and a core, a heat-dissipating, electro-insulative housing encapsulates the coil windings and the core. The housing is made of a cured molded article or material formed of a resin-filler composition which comprises a liquid unsaturated polyester resin, a finely divided calcium carbonate powder, an inorganic mineral particulate having a particle size larger than that of the calcium carbonate powder, and a chopped glass fiber, wherein the ratio by weight of the calcium carbonate to the mineral particulate is 0.3 to 4, the ratio of the weight of glass fiber to the total weight of the composition is 0.05 to 0.25, the ratio of the weight of the polyester resin to the total weight of the composition is 0.1 to 0.4 and the weight ratio of the calcium carbonate powder, the mineral particulate and the glass fiber to the total weight of the composition is 0.6 to 0.9. The disclosure is also concerned with a dynamoelectric machine having a housing made of a cured article of a composition containing a certain amount of clay powder as a separation inhibitor.

Dynamoelectric machine having coil windings and core encapsulated with

A novel thermosetting resin composition consisting essentially of (a) an isocyanate group-terminated condensate obtained by reacting a polycarboxylic acid compound having at least one acid anhydride ring with a stoichiometrical excess of a polyfunctional isocyanate compound or said condensate containing the unreacted isocyanate compound, (b) a polyfunctional epoxy compound and (c) a catalyst which forms mainly isocyanurate rings and oxazolidone rings. A cured product having excellent thermal resistance and excellent high temperature strength can be obtained by heating said composition.

Novel thermosetting resin composition and cured product therefrom

An epoxy resin composition having a remarkably improved storage stability and an excellent hardening characteristic when heated, which comprises an epoxy resin and an aromatic amino carboxylic acid or a derivative thereof as a hardener for the epoxy resin. This composition can be molded by injection molding, heretofore being deemed inapplicable to epoxy resin compositions, whereby the molded articled of epoxy resin can be produced with a high molding efficiency.

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Hitachi, Japan

Akio Nishikawa