Boise, ID, United States of America

Ahmed H Abdelnaby

This inventor holds 1 USPTO granted patent. Top assignee: Micron Technology Incorporated. Active years: 2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ahmed H Abdelnaby. Retrieved from https://idiyas.com/inventor/ahmed-h-abdelnaby

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2016

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1 patent (USPTO):Explore Patents

Title: Ahmed H Abdelnaby: Innovator in Semiconductor Manufacturing

Introduction

Ahmed H Abdelnaby is a notable inventor based in Boise, ID (US). He has made significant contributions to the field of semiconductor manufacturing. His innovative work focuses on improving the efficiency and effectiveness of wafer stack production.

Latest Patents

Ahmed holds a patent for "Engineered carrier wafers." This patent discloses apparatuses and methods for reducing the warp of semiconductor wafer stacks during manufacturing. The engineered carrier wafer may be pre-stressed to exhibit a warp that counteracts the warp of a device wafer included in the wafer stack. This innovation aims to reduce the overall warp of the wafer stack, enhancing the manufacturing process.

Career Highlights

Ahmed is currently employed at Micron Technology Incorporated, a leading company in the semiconductor industry. His work at Micron has allowed him to apply his innovative ideas in a practical setting, contributing to advancements in technology.

Collaborations

Ahmed collaborates with his coworker, Sony Varghese, to further enhance their projects and innovations in semiconductor manufacturing.

Conclusion

Ahmed H Abdelnaby is a dedicated inventor whose work in engineered carrier wafers is paving the way for advancements in semiconductor manufacturing. His contributions are vital to the ongoing evolution of technology in this field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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