Portland, OR, United States of America

Aaron Peterson

This inventor holds 1 USPTO granted patent. Top assignee: Cmc Materials, Inc.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Aaron Peterson. Retrieved from https://idiyas.com/inventor/aaron-peterson-uok9oqdj

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovations of Aaron Peterson

Introduction

Aaron Peterson is an accomplished inventor based in Portland, OR. He has made significant contributions to the field of chemical-mechanical polishing. His innovative work has led to the development of a unique subpad that enhances the polishing process.

Latest Patents

Aaron holds a patent for a "Chemical-mechanical polishing subpad having porogens with polymeric shells." This invention involves a subpad designed for chemical-mechanical polishing pads, featuring porogens with polymeric shells. The patent also describes methods for fabricating the subpad and polishing pads with a polishing surface layer bonded to the subpad layer.

Career Highlights

Aaron is currently employed at CMC Materials, Inc., where he continues to push the boundaries of innovation in his field. His work has been instrumental in advancing the technology used in chemical-mechanical polishing.

Collaborations

Aaron collaborates with talented individuals such as Dustin Miller and Paul Andre Lefevre. Their combined expertise fosters a creative environment that drives innovation.

Conclusion

Aaron Peterson's contributions to the field of chemical-mechanical polishing exemplify the spirit of innovation. His patent and ongoing work at CMC Materials, Inc. highlight his commitment to advancing technology in this area.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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