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Cernusco sul Naviglio, Italy

Technoprobe S.p.a.

USPTO Granted Patents = 55

% Expired Patents = 3.6

EPO Patents = 26

Trademarks = 1

Forward Citations = 50

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23 inventors (with patents filed for the assignee):

Roberto Crippa (19 out of 19 patents)

Flavio Maggioni (13 out of 13 patents)

Raffaele Vallauri (11 out of 11 patents)

4. Riccardo Vettori (10 out of 10 patents)

5. Riccardo Liberini (6 out of 6 patents)

6. Stefano Felici (6 out of 9 patents)

7. Giuseppe Crippa (6 out of 9 patents)

8. Daniele Perego (3 out of 3 patents)

9. Stefano Felici (3 out of 4 patents)

10. Fabio Morgana (2 out of 2 patents)

11. Daniele Acconcia (2 out of 2 patents)

12. Andrea Calaon (1 out of 1 patent)

13. David Heriban (1 out of 5 patents)

14. Jean-Christophe Villain (1 out of 16 patents)

15. Simone Todaro (1 out of 1 patent)

Core Competencies:

Probe Head

Testing Apparatus

High-Frequency

Contact Probe

Probe Card

Manufacturing Method

Electronic Devices

Enhanced Filtering

Vertical Probes

Current Capacity

Automated Assembly

Multi-Layer

55 patents: Sort by Forward Citations

1. 12571838 - Probe head for testing electronic devices comprising integrated optical elements (2026-03-10),

2. 12487253 - Large probe head for testing electronic devices and related manufacturing method (2025-12-02),

3. 12455299 - Contact element for a probe head for testing high-frequency electronic devices and relating probe head (2025-10-28),

4. 12313655 - Testing head having improved frequency properties (2025-05-27),

5. 12292457 - Flexible membrane adapted to carry high-frequency (RF) power signals and corresponding probe card for the high-frequency (RF) power test of electronic devices (2025-05-06),

6. 12259407 - Contact probe for probe heads of electronic devices (2025-03-25),

7. 12105118 - Testing head with an improved contact between contact probes and guide holes (2024-10-01),

8. 12085588 - Vertical probe head with improved contact properties towards a device under test (2024-09-10),

9. 12044703 - Contact probe for high-frequency applications with improved current capacity (2024-07-23),

10. 12032003 - Probe head for electronic devices and corresponding probe card (2024-07-09),

11. 12019111 - Manufacturing method of a multi-layer for a probe card (2024-06-25),

12. 12000879 - Apparatus for the automated assembly of a probe head (2024-06-04),

13. 11971449 - Probe head for a testing apparatus of electronic devices with enhanced filtering properties (2024-04-30),

14. 11953522 - Probe head for reduced-pitch applications (2024-04-09),

15. 11921133 - Testing head having improved frequency properties (2024-03-05),

Company Overview

Technoprobe S.p.a., headquartered in Cernusco sul Naviglio, Italy, specializes in advanced probe technology for the semiconductor industry. The company focuses on developing and manufacturing high-performance probe heads, testing apparatus, and probe cards that enhance the efficiency of electronic device testing. With expertise in high-frequency applications and innovative manufacturing methods, Technoprobe is committed to delivering solutions that improve the accuracy and reliability of electronic testing processes.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

55 Patents

#2 in Cernusco sul Naviglio

#162 in Italy

#12,922 in the World

Cernusco sul Naviglio, Italy

Technoprobe S.p.a.

Forward Citations = 50

23 inventors:

Roberto Crippa (19 out of 19 patents)

Flavio Maggioni (13 out of 13 patents)

Raffaele Vallauri (11 out of 11 patents)

4. Riccardo Vettori (10 out of 10 patents)

5. Riccardo Liberini (6 out of 6 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Technoprobe S.p.a.. Retrieved from https://idiyas.com/company/technoprobe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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