The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2024

Filed:

Nov. 07, 2019
Applicant:

Technoprobe S.p.a., Cernusco Lombardone, IT;

Inventors:

Roberto Crippa, Cernusco Lombardone, IT;

Flavio Maggioni, Cernusco Lombardone, IT;

Raffaele Vallauri, Cernusco Lombardone, IT;

Assignee:

TECHNOPROBE S.P.A., Cernusco Lombardone, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 1/073 (2006.01); G01R 3/00 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
G01R 3/00 (2013.01); G01R 1/07342 (2013.01); H05K 3/0029 (2013.01); H05K 3/4061 (2013.01); H05K 3/4679 (2013.01);
Abstract

A method of manufacturing a multi-layer for a probe card comprises providing first contact pads on an exposed face of a first dielectric layer and second contact pads on an exposed face of a last dielectric layer. Each dielectric layer is laser ablated to realize pass-through structures and the pass-through structures are conductively filled to realize conductive structures. The dielectric layers are superimposed in a way that each conductive structure contacts a corresponding conductive structure of a contiguous dielectric layer in the multi-layer and forms conductive paths electrically connected the first and second contact pads. The second contact pads having a greater distance between its symmetry centers than the first contact pads, the multi-layer thus performing a spatial transformation between the first and second contact pads connected through the connective paths.


Find Patent Forward Citations

Loading…