The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 09, 2024

Filed:

Dec. 17, 2020
Applicant:

Technoprobe S.p.a., Cernusco Lombardone, IT;

Inventors:

Roberto Crippa, Cernusco Lombardone, IT;

Stefano Felici, San Jose, CA (US);

Assignee:

TECHNOPROBE S.P.A., Cernusco Lombardone, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/073 (2006.01); G01R 1/067 (2006.01); G01R 31/28 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0735 (2013.01); G01R 1/06744 (2013.01); G01R 1/06755 (2013.01); G01R 1/07357 (2013.01); G01R 1/07378 (2013.01); G01R 31/2889 (2013.01);
Abstract

A probe head for a testing apparatus integrated on a semiconductor wafer is disclosed having a first plurality of contact probes having a first transversal diameter, a second plurality of micro contact probes having a second transversal diameter, smaller than the first transversal diameter, and a flexible membrane having conductive tracks for connecting a first plurality contact probe with a corresponding second plurality micro contact probe. The second plurality contact probes are arranged between the testing apparatus and the flexible membrane, and the second plurality micro contact probes are arranged between the flexible membrane and a semiconductor wafer. The second plurality micro contact probes are configured to abut onto contact pads of a device under test integrated in the semiconductor wafer, with each first plurality contact probe being in contact with a corresponding second plurality micro contact probe through a conductive track of the flexible membrane to connect the device under test with the testing apparatus.


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