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For the Inventor, By the Inventor

Kansas City, KS, United States of America

Smiths Interconnect Americas, Inc.


USPTO Granted Patents = 15


Trademarks = 7

Forward Citations = 7

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29 inventors (with patents filed for the assignee):

goldMedal Richard A Johannes (6 out of 11 patents)

silverMedal Jiachun Zhou (3 out of 6 patents)

bronzeMedal Dexian Liu (2 out of 3 patents)

4.  Robert Milligan (2 out of 2 patents)

5.  Michael Joseph Kettner (2 out of 2 patents)

6.  Moamer Hasanovic (2 out of 2 patents)

7.  Conrad William Jordan (2 out of 2 patents)

8.  Kenneth Stanevich (1 out of 1 patent)

9.  Khaled Elmadbouly (1 out of 1 patent)

10.  Noah Weichselbaum (1 out of 1 patent)

11.  Kevin Deford (1 out of 1 patent)

12.  Jim Spooner (1 out of 1 patent)

13.  Bo Shi (1 out of 2 patents)

14.  Jedidiah Bentz (1 out of 1 patent)

15.  Robert Meunier (1 out of 2 patents)


15 patents:

1. 12640701 - Systems and methods for frequency equalization and temperature compensation in radio frequency devices (2026-05-26),
2. 12210036 - Test socket for semiconductor integrated circuits (2025-01-28),
3. 12057661 - Isolated pair quadrax interconnect (2024-08-06),
4. 12032000 - Test socket assemblies with liquid cooled frame for semiconductor integrated circuits (2024-07-09),
5. 11973296 - Highly configurable and modular high-speed connector system (2024-04-30),
6. 11430587 - High frequency spiral termination (2022-08-30),
7. 11362459 - Moisture-sealed connector (2022-06-14),
8. 11283206 - Impedance controlled metallized plastic socket (2022-03-22),
9. 11221348 - Impedance controlled test socket (2022-01-11),
10. 11101598 - Dry mate rotatable connector (2021-08-24),
11. 11070011 - Remotely configurable connector (2021-07-20),
12. 11031713 - Spring probe connector for interfacing a printed circuit board with a backplane (2021-06-08),
13. 10818992 - Integrated spring mounted chip termination (2020-10-27),
14. 10522944 - Disposable electrical connector having a printed circuit board (2019-12-31),
15. 10505312 - Hot mate contact system (2019-12-10),
Company Overview
Smiths Interconnect Americas, Inc. is a key player in the design and manufacture of advanced connectivity solutions for critical applications across various sectors. Specializing in high-reliability electronic components and systems, the company serves industries such as aerospace, defense, telecommunications, and medical technology. With a focus on innovation, Smiths Interconnect develops products that ensure robust performance in demanding environments, contributing to the advancement of technology in North America and beyond.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 20 2026

15 Patents

#3 in Kansas City, KS

#152 in Kansas

#21,068 in US

#39,959 in the World

Kansas City, KS (US)
Kansas City, KS, United States of America

Smiths Interconnect Americas, Inc.

Forward Citations = 7

29 inventors:

goldMedal Richard A Johannes (6 out of 11 patents)

silverMedal Jiachun Zhou (3 out of 6 patents)

bronzeMedal Dexian Liu (2 out of 3 patents)

4.  Robert Milligan (2 out of 2 patents)

5.  Michael Joseph Kettner (2 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Smiths Interconnect Americas, Inc.. Retrieved from https://idiyas.com/company/smiths-interconnect-americas

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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