The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 27, 2020

Filed:

Sep. 22, 2017
Applicant:

Smiths Interconnect Americas, Inc., Kansas City, KS (US);

Inventors:

Christopher Raymond Hawn, Port St. Lucie, FL (US);

Michael Joseph Kettner, Stuart, FL (US);

Assignee:

SMITHS INTERCONNECT AMERICAS, INC., Kansas City, KS (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/26 (2006.01); H03H 7/38 (2006.01); H05K 7/20 (2006.01); H01L 23/00 (2006.01); H01L 23/66 (2006.01); H01L 23/40 (2006.01); H01C 13/00 (2006.01);
U.S. Cl.
CPC ...
H01P 1/26 (2013.01); H01L 23/66 (2013.01); H01L 24/73 (2013.01); H03H 7/38 (2013.01); H05K 7/2049 (2013.01); H01C 13/00 (2013.01); H01L 23/40 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/37 (2013.01); H01L 24/84 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/37011 (2013.01); H01L 2224/37013 (2013.01); H01L 2224/73213 (2013.01); H01L 2224/84801 (2013.01);
Abstract

An integrated spring mounted chip termination for converting energy of a circuit into heat to be absorbed by a heatsink. The integrated spring mounted chip termination includes an input tab configured to connect to the circuit. The integrated spring mounted chip termination also includes a chip termination having a top surface. The chip termination includes an input contact located on the top surface and configured to connect to the input tab, a resistor element located on the top surface and connected to the input contact, and a ground contact located on the top surface and connected to the resistor element. The integrated spring mounted chip termination also includes a formed ground spring connected to the ground contact of the chip termination, the formed ground spring configured to attach the chip termination to the heatsink, such that the chip termination and the heatsink are in contact.


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